Capabilities
PCB Fabrication
PCB design
Our resource of senior level designers has extensive experience in the following
- High frequency RF Boards
- XPCI Backplane
- Large multi-processor motherboards
- Latest memory busses including DDR2 and DDR3
- High Amperage and voltage designs
- Multiple lamination designs using Buried, blind, and micro/laser drills
- Buried Resistor experienced
- Complicated impedance designs
- Controlled high speed busses on current chipsets
- Analog and digital mixed designs
- Flex and Rigid Flex designs
- ATE design
- Probe design
- RF antenna designs
- Design library creation
| SHOP TOLERANCE | Standard | Advanced | Emerging |
| Minimum Outer Line Width | 0.0889 | 0.0635 | 0.0508 |
| Minimum Inner Line Width | 0.0762 | 0.0635 | 0.0508 |
| Minimum Outer Space Trace / Trace | 0.0889 | 0.0762 | 0.0635 |
| Minimum Inner Space, Trace / Trace | 0.0889 | 0.0762 | 0.0508 |
| Minimum Outer Space, Trace / Pad | 0.0635 | 0.0508 | < .0381 |
| Minimum Inner Space, Trace / Pad | 0.0635 | 0.0508 | <.0381 |
| Layer-to-Layer Registration | +/- .127 | +/- .0762 | +/- .0254 |
| Maximum Finished PCB Thickness | 6.35 | 7.62 | > 8.38 |
| Board Thickness Tolerance | +/- 8% | +/- 4% | < 4% |
| Dimensions - Hole Location | +/- .0508 | +/- .0381 | +/- .0254 |
| Dimensions - Fab O.D. | +/- .254 | +/- .127 | +/- .0762 |
| Fabrication Radius | +/- 5 Degrees | +/- 5 Degrees | +/- 5 Degrees |
| Warpage (inch per inch) (flatness of finished board) | 0.1524 | 0.0762 | 0.0508 |
| Minimum Dielectric Thickness | 0.1016 | 0.0254 | < .0254 |
| Maximum Number of Layers | < 50 | 50 - 58 | > 60 |
| Maximum Panel Size | 60.9 x 76.2cm (usable 57.1 x 72.4cm) |
| PAD TO HOLE SIZE | Standard | Advanced | Emerging |
| Minimum Plated Hole Size * (Finished) | 0.004 | 0.004 | 0.003 |
| Tolereance- Plated Hole Size | +/- .003 | +/- .002 | +/- .001 |
| Minimum Inner Layer Pad | .008 | .006 | .004 |
| (1 mil annular ring) | OVER F.H.S | OVER F.H.S. | OVER F.H.S. |
| Mech.Min. Drill Hole Size | 0.006 | 0.004 | < .004 |
| Normal Finished Hole Size | 0.002 | 0.002 | < .002 |
| Plane Relief Diameter Over Drilled Hole | 0.012 | 0.01 | 0.006 |
| Minimum Outer Layer Pad | 0.008 | 0.006 | 0.004 |
| (1 mil annular ring) | OVER F.H.S. | OVER F.H.S. | OVER F.H.S. |
| Min. Outer Non-Plated Hole to Metal | 0.008 | 0.006 | < .006 |
| Min.Inner Non-Plated Hole to Metal | 0.008 | 0.006 | < .006 |
| Max. Number holes/sq. in. (average over board) | 1000 | 1500 + | 2000 + |
| DRILLING | Standard | Advanced | Emerging |
| Maximum Aspect Ratio | 25:1 | 34:1 | 75:1 |
| TESTING CAPABILITIES | Standard | Advanced | Emerging |
| Flying Probe Testing | Minimum Pitch: .005 Minimum feature size: .002 |
||
| Universal Grid Tester (UGT) | N/A | ||
| SOLDERMASK CRITERIA | Standard | Advanced | Emerging |
| SMT Minimum Pad Spacing | 0.006 | 0.005 | 0.004 |
| Line to SMT Minimum Space | 0.0035 | 0.003 | < .003 |
| Minimum Soldermask Rib | 0.005 | 0.004 | 0.003 |
| ELECTRICAL CHARACTERISTICS | Standard | Advanced | Emerging |
| Impedance Tolerance * | +/- 10% | +/- 5% | +/- 3% |
| SHOP TOLERANCE | Standard | Advanced | Emerging |
| Minimum Outer Line Width | 0.0889 | 0.0635 | 0.0508 |
| Minimum Inner Line Width | 0.0762 | 0.0635 | 0.0508 |
| Minimum Outer Space Trace / Trace |
0.0889 | 0.0762 | 0.0635 |
| Minimum Inner Space, Trace / Trace |
0.0889 | 0.0762 | 0.0508 |
| Minimum Outer Space, Trace / Pad |
0.0635 | 0.0508 | < .0381 |
| Minimum Inner Space, Trace / Pad |
0.0635 | 0.0508 | <.0381 |
| Layer-to-Layer Registration | +/- .127 | +/- .0762 | +/- .0254 |
| Maximum Finished PCB Thickness | 6.35 | 7.62 | > 8.38 |
| Board Thickness Tolerance | +/- 8% | +/- 4% | < 4% |
| Dimensions - Hole Location | +/- .0508 | +/- .0381 | +/- .0254 |
| Dimensions - Fab O.D. | +/- .254 | +/- .127 | +/- .0762 |
| Fabrication Radius | +/- 5 Degrees | +/- 5 Degrees | +/- 5 Degrees |
| Warpage (inch per inch) (flatness of finished board) | 0.1524 | 0.0762 | 0.0508 |
| Minimum Dielectric Thickness | 0.1016 | 0.0254 | < .0254 |
| Maximum Number of Layers | < 50 | 50 - 58 | > 60 |
| Maximum Panel Size | 60.9 x 76.2cm (usable 57.1 x 72.4cm) |
| PAD TO HOLE SIZE | Standard | Advanced | Emerging |
| Minimum Plated Hole Size * (Finished) | 0.0101 | 0.1016 | < .1016 |
| Tolereance - Plated Hole Size | +/- .0762 | +/- .0508 | +/- .0254 |
| Minimum Inner Layer Pad | 2032 | 1524 | 1016 |
| (1 mil annular ring) | OVER F.H.S | OVER F.H.S. | OVER F.H.S. |
| Mech. Min. Drill Hole Size | 0.1524 | 0.1016 | 0.0762 |
| Normal Finished Hole Size | 0.0508 | 0.0508 | < .0508 |
| Plane Relief Diameter Over Drilled Hole | 0.3048 | 0.254 | 0.1524 |
| Minimum Outer Layer Pad | 0.2032 | 0.1524 | 0.1016 |
| (1 mil annular ring) | OVER F.H.S. | OVER F.H.S. | OVER F.H.S. |
| Min. Outer Non-Plated Hole to Metal | 0.2032 | 0.1524 | < .1524 |
| Min. Inner Non-Plated Hole to Metal | 0.2032 | 0.1524 | < .1524 |
| Max. Number holes/sq. in. (average over board) | 1000 | 1500 + | 2000 + |
| DRILLING | Standard | Advanced | Emerging |
| Maximum Aspect Ratio | 25:1 | 34:1 | 75:1 |
| TESTING CAPABILITIES | |||
| Flying Probe Testing | Minimum Pitch: .005 Minimum feature size: .002 |
||
| Universal Grid Tester (UGT) | N/A | ||
| SOLDERMASK CRITERIA | Standard | Advanced | Emerging |
| SMT Minimum Pad Spacing | 0.1524 | 0.127 | 0.1016 |
| Line to SMT Minimum Space | 0.0889 | 0.0762 | <.0762 |
| Minimum Soldermask Rib | 0.127 | 0.1016 | 0.0762 |
| ELECTRICAL CHARACTERISTICS | |||
| Impedance Tolerance * | +/- 10% | +/- 5% | +/- 3% |